Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. The company's precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding process and package singulation. It also offers precision processing tools comprising dicing blades, grinding wheels, and dry polishing wheels; and other products, such as accessory equipment, as well as frames and cassettes, and additives for cutting waters. In addition, the company is involved in the disassembly and recycling of precision cutting, grinding, and polishing machines, as well as provides training services for the maintenance and operation of its products. Further, it leases precision machines; and purchases and sells used machines. The company was founded in 1937 and is headquartered in Tokyo, Japan.

Semiconductori

Mr. Noboru  Yoshinaga

Executive Vice President, Representative Executive Officer, GM of Sales Division & Director

Mr. Kazuma  Sekiya

Nume	Capitalizare de piață
Nanoco Group plc	0M
ROHM Co., Ltd.	0M
Applied Materials, Inc.	0M
Intel Corporation	0M
Amtech Systems, Inc.	0M
DB HiTek CO., LTD.	0M
Nations Technologies Inc.	0M
Wuxi Autowell Technology Co.,Ltd.	0M
NXP Semiconductors N.V.	0M
Jiangyin Jianghua Microelectronics Materials Co., Ltd	0M

Disco Corporation

Disco Corporation Lista concurenților

Principalii concurenți