ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.

Напівпровідники

Mr. Rui Rong  Lo

GM of Kaohsiung Plant & Representative Director

Dr. Tien Yu  Wu

Group Chief Operating Officer & Representative Director

Dr. Shi Hua  Pan

Group Chief of Staff

Mr. Bo-Lian  Li

Senior Vice President

Mr. Joseph  Tung

Group Chief Financial Officer & Representative Director

Mr. Dtuang  Wang

Chief Administrative Officer, Chief Corporate Governance Officer & Company Secretary

Назва	Ринкова капіталізація
Nanoco Group plc	0M
ROHM Co., Ltd.	0M
Applied Materials, Inc.	0M
Intel Corporation	0M
Amtech Systems, Inc.	0M
DB HiTek CO., LTD.	0M
Disco Corporation	0M
Wuxi Autowell Technology Co.,Ltd.	0M
Microchip Technology Incorporated	0M
Jiangyin Jianghua Microelectronics Materials Co., Ltd	0M
NXP Semiconductors N.V.	0M

ASE Technology Holding Co., Ltd.

ASE Technology Holding Co., Ltd. Список конкурентів

Основні конкуренти