BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide. The company's principal products include die attach equipment, such as single chip, multi chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra thin, and wafer level molding, as well as trim and form, and singulation systems. Its principal products also comprise plating equipment comprising tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. The company was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

Halvledere

Mr. Jeroen  Kleijburg

Senior Vice President of Packaging

Mr. Christoph  Scheiring

Senior Vice President of Die Attach

Andrea  Kopp-Battaglia

Senior Vice President of Finance- Die Attach

Mr. Henk-Jan Jonge Poerink

Senior Vice President of Global Operations

Mr. Leon  Verweijen

Senior Vice President of Finance

Edmond  Franco

Vice President of Corporate Development

Mr. Richard W. Blickman

Chairman of Management Board, President & Chief Executive Officer

Mr. Rene W. Hendriks

Senior Vice President of Sales - North America & Europe

Mr. Peter  Wiedner

Senior Vice President of Sub Micron Die Attach

Mr. Jong Kwon Park

Senior Vice President of Sales & Customer Support - APAC

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BE Semiconductor Industries N.V.

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